SBE公司近期推出了专门为Infineon英飞凌IGBT HP Drive(HYBRIDPACK Driver Module) FS600R07A2E3 配套的电容器,型号700A185LV,400μF at 450V,电容厚度只有38mm,极大方便了客户的设计。
Offering:
Optimized and industry leading power density
Integration of the capacitor and bus
Integrated shared cooling of IGBT, bus and capacitor results in highest power density
Lowest Cap ESR and thermal resistance
DC and IGBT terminal configuration optimizing capacitor effectiveness
Very low inductance
Increased usable operating voltage
Reduced cost, weight, and footprint
Configurable for 450V – 600V
Adaptable to Si or SiC switching
Vertical and horizontal configurations
Market ready for transportation and motor drives
Integrated Components:
SBE low inductance film capacitors integrated with the bus structure
Total capacitance: 400μF at 450V
250μF at 600V
Vertical: 12H ESL
Horizontal: 8nH ESL*
450V: 190A at 70°C coolant, 293μΩ ESR
600V: 172A at 70°C coolant, 358μΩ ESR
Reduced total copper cost and weight
Cooling Plate (sold separately)
IGBT Module
Infineon HP Drive™
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